Integrated circuit comprising at least an integrated antenna

ABSTRACT

A probe card for integrated circuit testing includes a printed circuit support and a probe head having a first surface mounted to a surface of the printed circuit support. A flexible substrate is positioned adjacent to a second surface of the probe head and includes at least one flexible extension which extends beyond an edge of the probe head and includes a bend to make contact with the surface of the printed circuit support. The flexible substrate further includes a test antenna configured to support a wireless communications channel with an integrated circuit under test. The integrated circuit under test includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations to form an integrated antenna that is coupled for communication and/or power transfer to the test antenna.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application for patent Ser.No. 15/431,877, filed Feb. 14, 2017, which is a division of U.S.application for patent Ser. No. 15/208,269 filed Jul. 12, 2016 (issuedas U.S. Pat. No. 9,607,912), which is a division of U.S. application forpatent Ser. No. 14/926,269 filed Oct. 29, 2015 (issued as U.S. Pat. No.9,419,071), which is a continuation of U.S. application for patent Ser.No. 13/560,632 filed Jul. 27, 2012, (issued as U.S. Pat. No. 9,188,635),which claims the priority benefit of Italian patent application numberMI2011A001416, filed on Jul. 28, 2011, the disclosures of which arehereby incorporated by reference to the maximum extent allowable by law.

TECHNICAL FIELD

Embodiments relate to an integrated circuit provided with at least oneintegrated antenna. Embodiments particularly, but not exclusively,relate to an wafer integrated circuit and the following description ismade with reference to this field of application by way of illustrationonly.

DISCUSSION OF THE RELATED ART

As it is well known, for the electric selection of devices executed onwafer, i.e. the so called testing EWS (acronym from“Electrical-Wafer-Sorting”), it is necessary to electrically connect atester or ATE (acronym from “Automated Test Equipment”) that executesmeasures on a wafer whereon there are electronic components to be testedor selected or probed, in particular integrated circuits or chips. Aterminal portion of the test system is schematically shown in FIG. 1A,globally indicated with 1.

The interface between the real tester ATE 1A and a wafer 6 comprising aplurality of devices to be tested or selected, in particular chips 7(also indicated as integrated circuits or IC, acronym from “IntegratedCircuit”) is a so called probe card 2, which is essentially a board madeof a PCB (acronym of “Printed Circuit Board”) and of a probe head 3 thatcomprises hundreds (many times thousands) of different probes 4 thatelectrically connect the tester ATE 1A to almost all the contact pads 8of a chip 7 to be tested, as shown in greater detail but alwaysschematically in FIG. 1B. In particular, each end portion or tip 9 ofthe probes 4 enters in contact with a contact pad 8 of the chip 7.

In general, the wafer 6 groups a plurality of chips 7 to be tested, andduring the testing steps it is placed on a support called chuck 5, shownin the portion of the test system 1, and belonging to an apparatuscalled also prober (not shown in the figure), this support being thusindicated also as prober chuck.

The number of contact pads 8 being needed for a determined testing maybe smaller or identical to the total number of contact pads 8 present onthe chip 7 to be tested.

The procedure goes on in a similar way even if on the chips 7 there arecontact bumps instead of contact pads 8, as it is well known totechnicians in the field.

For positioning the probes 4 on the contact pads 8, the prober usesoptical recognition operated by video cameras which focus on somedetails on one side of the wafer and on the other the probes or specialbidimensional markers called Fiducials (not shown) which are placed onthe probe card 2 outside the array of probes 4. However, the recognitionof these bidimensional Fiducials requires additional algorithms andnecessitates ties on the construction of the probe card 2, and inparticular on the realization of the array of probes 4.

Before each chip 7 is encapsulated into a respective package, it isknown that it is necessary to execute the testing of the chip 7 itselfstill on the wafer 6, by using the probes 4 that are directly connectedto the contact pads 8, and that thus execute the so called probing ofthe contact pad 8 they enter in contact with.

After the testing, the wafer 6 is cut and the chips 7 that have beentested and proved to be working are assembled in their package, readyfor further process steps, also comprising final testing steps of thechip 7 themselves in the package wherein they have been assembled.

To this purpose, on the wafer 6, between a chip 7 and another, an areais created called scribe line SL within which a saw or a laser will passduring the cutting or singulation operation, necessary for separatingthe various devices present on the wafer for executing the variousassembling and encapsulating or packaging steps of the same devices, asschematically shown in FIG. 2. In particular, in the schematicenlargement indicated by way of illustration in FIG. 2, a group of fourchips 7, indicated as IC A, IC B, IC C and IC D, is separated by a firstscribe line SL1, in particular horizontal according to the localreference of the figure, and a second scribe line SL2, in particularvertical, in the local reference of the figure.

Moreover, as shown in this figure, in the scribe lines (in particular inthe first scribe line SL1) elementary structures are introduced, usuallyindicated as structures TEG (acronym of “Test Element Group”), thesestructures being used, for example, for the testing of some processparameters, which are measured in general before the electric test onwafer EWS.

Further, each chip 7 is surrounded, in a known way to those skilled inthe art, by a protection structure, the so called seal ring 7A.

More in particular, the seal ring 7A has the aim of sealing therespective chip 7 and strengthening it mechanically for ensuring itsreliability also further to the mechanical effort exerted by the sawduring the cut or singulation of the chip 7 from the wafer 6.

The seal ring 7A is usually placed between an area where the contactpads of the chip itself, normally indicated as pad ring, and the scribeline SL confining with the chip itself are placed.

It is known that the seal ring 7A comprises a plurality of metal layersand of vias that connect them so as to realize a structure able to alsoblock ions and polluting substances (such as, for example, humidity)which could jeopardize the proper operation of the chip 7 after thesingulation.

Different implementations are known for the realization of a seal ringof an integrated electronic device or chip. For example, in U.S. Pat.No. 6,300,223 by Chang et al., there is described a structure of a sealring where dielectric layers and metallic layers are alternated, thestructure being also provided with a trench for reducing the mechanicalstresses at the singulation of the chips from the wafer. Otherstructures suitable for realizing a seal ring are also known from U.S.Pat. No. 7,605,448 by Furusawa et al. and U.S. Pat. No. 6,492,716 byBothra et al.

For avoiding problems of radiofrequency interferences that couldjeopardize the operation of the chip, it is also known to suitably cutthe seal ring in those points where substrate disturbances could beinjected, these disturbances coming from internal circuits of the chipitself (such as power amplifiers, clock signal generators, input/outputdigital signal processing circuits, etc).

This technique for cutting the seal ring is also diffusely adopted forproblems tied to the coupling with integrated inducers used atradiofrequency and microwaves for the following circuits: LNA, mixer,VCO, filters, etc. This measure is adopted in this case with the aim ofeliminating the currents induced in the seal ring further to the passageof current in the inducers themselves, in particular the so called “eddycurrents” or Foucault currents. In substance, the seal ring is cut so asto have an open ring structure, instead of a closed ring one, so as toavoid that it comprises coils through which the eddy currents couldflow.

This technique for cutting the seal ring is also adopted for problemstied to the coupling with typically inductive integrated antennas usedat radiofrequency and microwaves for the transmission of wirelesssignals. This measure is also, in this case, adopted so as to eliminatethe currents induced in the seal ring further to the passage of currentin the antennas themselves. Like in the previous case, the seal ring iscut so as to have an open ring structure, instead of closed ring, so asto avoid that circular paths are formed through which the eddy currentscould flow.

It is to be specified that the eddy currents are such as to opposeagainst the currents generated in the antennas and/or in the inducers asprovided by the law of Faraday-Lenz. The drawback of these currents isthus that they produce a magnetic flow that opposes against thevariation of magnetic flow produced by the antenna and/or by the inducerpresent in the chip with a consequent reduction of its efficiency, inparticular the negative mutual coupling of the currents reduces thevalue of the effective inductance, while the energy dissipated by theeddy currents reduces the quality factor Q, as it is evident from thefollowing relation (referred to an inducer under optimal conditions):

$Q \cong \frac{\omega \cdot {Ls}}{Rs}$

being:

ω is the pulse of the current sinusoid that flows through the antennaand/or the inducer;

Ls the inductance value of the antenna and/or of the inducer; and

Rs the resistance value of the antenna and/or of the inducer.

It is also well known that a generic electronic device or chip isconnected to the surrounding world through connections such as wiredchannels (for example, cables, optical fibers, . . . ) or wirelesschannels (for example of the electromagnetic type). These connectionsallow for the exchange of information signals and/or to supply the chipsthemselves.

In case signals are to be exchanged through transmission of the magneticor electromagnetic type between a chip and at least another externalsystem, the chip should have inside at least one receiver/transmitter,also indicated as transceiver/transponder, connected to at least oneantenna that may be incorporated in the chip itself, as schematicallyshown in FIG. 3.

In particular, the chip 10 comprises a plurality of circuit portions 11,indicated also as Core 1 . . . Core 4, at least one of which, inparticular Core 1, connected to an antenna 12 through a devicetransmitter/receiver or transceiver/transponder 13.

Examples of chips provided with an antenna are the circuits RFId(acronym of “Radio Frequency Identification”) or the Smart Cards, thatare low power integrated circuits (low power IC), that may be suppliedand exchange information through the wireless channels (and thus withoutcontact or contactless) that use transmission of the magnetic and/orelectromagnetic type obtained by means of at least two antennas, of thetype shown schematically in FIGS. 4A and 4B.

The RFId circuit, globally indicated in these figures with 15, comprisesan antenna 17A, that may be, for example, a magnetic dipole or ahertzian dipole, which is connected to a chip 16A (in particular aRFId/Smart Card IC) in general by using bumps or wire bonds. The antenna17A and the chip 16A are, in general, both contained in a singlepackage. The antenna 17A is connected to the chip 16A, and this antenna17A may be outside the chip 16A, as indicated in FIG. 4A, or it may beembedded, and thus be part of an overall integrated circuit 16B aportion of which is the chip 16A, as indicated in FIG. 4B.

The RFId circuit 15 communicates, by means of the exchange ofelectromagnetic waves 18, with an external system, for example a reader14 that comprises in turn an antenna 17B and a reading system(RFId/Smart Card Reader) 19, including at least one chip 16C withcharacteristics functionally compatible with respect to the chip 16A.

The antenna 17A of FIG. 4B of the RFId circuit 15 may be of the magnetictype, in particular of the near field inductive type, and may bepositioned around the chip 16A, with an increase of the area of theoverall integrated circuit 16B itself and a consequent reduction of thetotal number of RFId circuits that may be placed on a wafer.

Antennas that work by using the electromagnetic field are described, forexample, in published US Patent Application Publication No. 2010/0026601in the name of Chang et al. In particular, these antennas are used forcell phones and operate far field thanks exactly to the electromagneticfield, comprising structures similar to hertzian dipoles or monopoles,suitably provided with reflectors. The structures proposed should nothave metallic parts positioned above the antenna, which might screen theelectromagnetic field. Also in this case, the antennas occupy a largearea, with consequent increase in the area of the integrated circuitthat comprises them.

Alternatively, the antenna may be also integrated above the chip toavoid such an area increase obtaining an On-Chip Antenna (OCA).

In this case, the performance of the antenna of the embedded type ishowever to be optimized, for maximizing the transfer of power, theelectromagnetic energy exchanged being used also for supplying the chipthat comprises the embedded antenna.

In particular, a known process for creating an antenna of the integratedor embedded type is a traditional diffusion process, which requires,however, additional masks and additional steps with respect to the wafermanufacturing process. Post processing methodologies are also known tocreate lower cost embedded antennas.

In each case, the antennas of the embedded type, now very used for RFIdor Smart Cards, have a limited operational range due to their sizes.

Antennas of the capacitive type are also known, that use the generic padof a chip as an armature of a capacitor.

In substance, the known solutions for realizing antennas integrated in achip should use suitable structures, having reduced sizes when they arededicated to the sole exchange of signals.

When instead also the power is to be transferred through the antenna, itis necessary to integrate with it structures of greater sizes. Thesestructures, however, may have the following drawbacks and/orconstraints:

-   -   if placed on the chip, they may require the use of integration        processes that involve at least one further metallization level        with respect to the realization of the chip itself, and    -   if placed around the chip, they may increase its area.

These drawbacks and/or constraints linked to the integration of antennasin a chip may require, in each case, an increase of the relativemanufacturing cost.

Moreover, the presence of structures such as, for example, the seal ringis however suitable for avoiding damages also of the integrated antennasduring the cutting step of the wafer, i.e. of singulation of the chipsrealized therein.

SUMMARY

An embodiment provides the integrated antenna in the circuit, incorrespondence with a peripheral portion of the same close to theseparation scribe line with the other circuits on the same wafer, theantenna developing on different planes with respect to a substratewherein the circuit is realized.

An embodiment provides an integrated circuit on a substrate of the typecomprising at least one peripheral portion that surrounds an active areaand is realized close to at least one scribe line providing separationwith other integrated circuits realized on the same wafer, at least oneconductive structure that extends in said peripheral portion ondifferent planes starting from said substrate and realizes an integratedantenna for said circuit.

According to an embodiment, the antenna may be realized by usingmetallization levels arranged on different planes suitably connected forensuring the correct operation of the antenna thus obtained.

According to an embodiment, the conductive structure of the antenna maycomprise a first plurality of conductive lines realized on differentplanes and suitably connected.

According to another embodiment, the circuit may also comprise a secondplurality of conductive lines, side by side with the first plurality andconnected so as to form a seal ring of the integrated circuit.

Furthermore, the integrated circuit may comprise conductive connectionsthat develop perpendicularly to these planes and connect conductivelines of the first plurality arranged on different but adjacent planes,as well as conductive connections that develop perpendicularly to theplanes and connect conductive lines of the second plurality arranged ondifferent but adjacent planes to form pillar structures of the sealring.

According to another embodiment, the seal ring may comprise a pluralityof pillar structures distributed in the peripheral portion.

Moreover, the conductive lines that form the antenna may beserpentine-like shaped and surround at least partially the pillarstructures of the seal ring or chain-like shaped and completely surroundthese pillar structures, or may cross these pillar structures throughcavities present in the pillar structures themselves.

According to another embodiment, the integrated circuit may furthercomprise reinforced pillar structures realized by portions of the secondplurality of conductive lines and having greater sizes thancorresponding sizes of the pillar structures of the seal ring, thereinforced pillar structures being positioned in correspondence withmechanically stressed points of the integrated circuit. In particular,these reinforced pillar structures may be positioned in correspondencewith the angles of the integrated circuit.

The integrated circuit may further comprise a junction suitably biasedand realized in the substrate below the antenna.

According to another embodiment, this junction may be realized by meansof a well being complementary doped with respect to the substrate.

Moreover, the integrated circuit may comprise suitably doped areasrealized in the substrate so as to extend substantially across theperipheral portion where the antenna is realized.

According to another embodiment, the integrated circuit may comprise atleast one trench realized in the substrate so as to extend substantiallyacross the peripheral portion where the antenna is realized and filledin with an insulating material.

Moreover, the integrated circuit may comprise an opening for uncoveringan upper portion of at least one of the pillar structures, whichcomprises a conductive line that extends up to the scribe line and/or atleast one conductive line that extends up to the active area of theintegrated circuit and realizes a pad for the integrated circuit and/orfor structures TEG realized in the scribe line.

According to this another embodiment, the integrated circuit maycomprise at least one conductive via of connection to a metallizationline of a structure TEG with the conductive line that extends up to thescribe line, this conductive via realizing a fragility point when asuccessive step of singulation of the integrated circuit from the waferwherein it is realized takes place.

Moreover, the seal ring may comprise at least one pair of pillarstructures connected by means of an intermediate reinforcing conductiveline.

The seal ring may also comprise at least one pillar structure providedwith a conductive line realized above it and having greater size withrespect to the remaining conductive lines of the second plurality thatrealize the pillar structure.

The integrated circuit may further comprise at least one linear elementthat passes between the pillar structures of the seal ring and forms theantenna.

According to another embodiment, the first plurality of conductive linesmay surround the active area and form at least one coil of the antenna,interrupted in correspondence with a cutting area for realizing at leastone pair of terminals of this antenna.

In particular, the conductive lines that form the antenna may be shapedso as to overhang at least in part a second plurality of conductivelines that form a seal ring and/or a further plurality of conductivelines that form a further seal ring, arranged inside and/or outside theantenna.

According to another embodiment, the integrated circuit may comprise asecond plurality of conductive lines that surround the active area andare connected to each other to form a seal ring of the integratedcircuit.

The conductive lines of the second plurality may be interrupted incorrespondence with a second cutting area, this second cutting areahaving the possibility to be in an opposite position with respect to thefirst cutting area of the first plurality of conductive lines.

Moreover, the second plurality of conductive lines of the seal ring maybe arranged outside the first plurality of conductive lines of theantenna towards the scribe line.

According to another embodiment, the integrated circuit may comprise afurther plurality of conductive lines connected so as to form a furtherseal ring in the peripheral portion of the integrated circuit.

In particular, the conductive lines of this further plurality may beinterrupted in correspondence with a further cutting area.

The further plurality of conductive lines of the further seal ring maybe positioned inside the first plurality of conductive lines of theantenna towards the active area of the integrated circuit, the furthercutting area being positioned in correspondence with the first cuttingarea for allowing the passage of the terminals of the antenna.

Alternatively, the further plurality of conductive lines of the furtherseal ring may be positioned between the first plurality of conductivelines of the antenna and the second plurality of conductive lines of theseal ring, the further cutting area being positioned so as not to bealigned with the second cutting area of the second plurality ofconductive lines.

The conductive lines of the first plurality that form the antenna may beshaped so as to overhang at least in part the second plurality ofconductive lines that form the seal ring and/or the further plurality ofconductive lines that form the further seal ring.

According to another embodiment, the circuit may further comprise atrench structure realized in a central portion of the scribe line, so asto penetrate into the scribe line up to at least the substrate level orpossibly at least partially also therein.

This trench structure may be covered by a protective layer and theantenna may act also as seal ring of the integrated circuit.

Alternatively, the conductive structure of the antenna may comprise atleast one trench structure suitably coated by at least one layer of aconductive material to form a coil of this antenna.

Furthermore, the antenna and/or the seal ring may comprise at least onematerial having magnetic features.

In particular, the trench structure may be filled in at least partiallywith a nonconductive filling material and may comprise above thisnonconductive filling material at least one further conductive materialto form a further coil of the antenna.

Moreover, the antenna is formed inside the trench structure by means ofa plurality of layers of a conductive material arranged at differentlevels with respect to the substrate and separated by a nonconductivematerial.

According to another embodiment, the antenna may comprise supportstructures arranged between its conductive paths.

These support structures may be realized by means of pillars of anonconductive material, vias of a nonconductive material, or by means ofvias comprising an external layer of a nonconductive material and filledin at least in part with a conductive material.

Moreover, this nonconductive material of the support structures maycomprise a material with magnetic features.

According to another embodiment, the antenna and/or the seal ring maycomprise at least one material having magnetic features.

Moreover, the integrated circuit may comprise, at least below theantenna, at least one TSV filled in with an insulating material.

Further, the integrated circuit may comprise, adjacent to the antenna,at least one trench comprising in turn at least one material havingmagnetic features for realizing a magnetic trench.

This magnetic trench may comprise a lateral coating portion realized ina magnetic material and filled in with a filling material.

According to another embodiment, the integrated circuit may comprise atleast one pair of magnetic trenches realized on the opposite part withrespect to the antenna and possibly a further insulating trench realizedin the substrate below the antenna and below the magnetic trenches,these magnetic trenches having the possibility to be realized with amagnetic material that extends also in the further insulating trench.

The integrated circuit may comprise further insulating and/or magnetictrenches, inside or around the further insulating trenches.

According to another embodiment, there is provided a system for testingat least one integrated circuit provided with an antenna and realized asabove indicated, the testing system comprising at least one probe cardprovided with a probe head wherein the probe card comprises at least onetest antenna being in wireless connection with the antenna of the atleast one integrated circuit.

According another embodiment, this testing system may comprise in thisprobe card at least one printed circuit whereto the probe head isconnected and in turn connected to a tester ATE, the probe card havingthe possibility in this case of comprising at least one substrate of aflexible material provided with at least one first arm, and possibly asecond arm, positioned between and connecting the probe head and theprinted circuit and the test antenna having the possibility to berealized in this flexible substrate substantially positioned incorrespondence with the antenna of the integrated circuit, so as torealize the wireless connection.

In particular, this testing system may further comprise at least oneprobe that extends from the probe head crossing the flexible substratefor coming into contact on a corresponding pad of the integrated circuitcreating a wired communication channel between the probe card and theintegrated circuit.

According to another embodiment, this at least one probe may havemagnetic features.

The testing system may further comprise an integrated test circuithoused in a suitable seat realized in the probe head and connected tothe flexible substrate and comprising circuits for the transmission andreception and possibly coding and decoding of the signals exchangedbetween the probe card and the integrated circuit.

The problem is solved also by a testing system of at least oneintegrated circuit provided with an antenna and realized as aboveindicated, the testing system comprising an antenna card directlyassociated with a tester ATE of the testing system and in turncomprising a substrate wherein at least one test antenna in wirelessconnection with the antenna of the at least one integrated circuit isrealized.

According to another embodiment, the antenna card may also comprisethree-dimensional elements projecting from the substrate in thedirection of the integrated circuit as three-dimensional Fiducials ableto be recognised by positioning video cameras of the testing system.

In particular, these three-dimensional elements may be bumps. Further,these three-dimensional elements may be positioned outside the testantenna.

According to another embodiment, there is provided a stacked structurecomprising at least one first and one second integrated circuit realizedas above indicated and wherein these first and second integratedcircuits are overlapped onto one another so as to place respectiveantennas in substantial alignment with each other along a developmentdirection of the same so as to create a wireless communication channelin the stacked structure.

These first and second integrated circuits may be separated from oneanother by a layer and possibly be overlapped onto each other so thatthe respective sublayers are in connection with this layer.Alternatively, these first and second integrated circuits may beseparated from one another by a gap.

According to another embodiment, there is also provided a packagesuitable for housing at least one integrated circuit provided with anantenna and realized as above indicated, this package comprising atleast an encapsulating material and a package substrate, as well asexternal connection elements, and an antenna suitable for realizing awireless connection with the antenna of the integrated circuit.

According to another embodiment, the antenna may be a discrete antennahoused on the package substrate.

Furthermore, the antenna may be realized in the package substrate.

According to another embodiment, there is provided a testing system ofat least one integrated circuit provided with an antenna realized asabove indicated and housed in a package of the above described type,comprising an interface connected to a tester ATE of the testing systemand provided with suitable contact terminals for the package, as well aswith a test antenna suitable for communicating in a wireless way withthe antenna of the integrated circuit.

According to another embodiment, the test antenna may be comprised inthe interface.

In an embodiment, an integrated circuit comprises: a substrate having atop surface; an insulating region above the top surface, said insulatingregion including a peripheral portion adjacent to a scribe line, saidperipheral portion including metallizations: an antenna structure formedby antenna lines arranged in a plurality of planes of saidmetallizations; and a seal ring formed by metal layers arranged in aplurality of planes of said metallizations and interconnected by vias;wherein the insulating region insulates the antenna lines of the antennastructure from the metal layers and vias of the seal ring; and anopening in an upper surface of the insulating region to expose a topsurface of a top-most one of the metal layers of the seal ring toprovide a contact pad.

In an embodiment, an integrated circuit comprises: a substrate having atop surface; an insulating region above the top surface, said insulatingregion including a peripheral portion adjacent to a scribe line, saidperipheral portion including metallizations: an antenna structure formedby antenna lines arranged in a plurality of planes of saidmetallizations; and a seal ring formed by metal layers arranged in aplurality of planes of said metallizations and interconnected by vias;wherein the insulating region insulates the antenna lines of the antennastructure from the metal layers and vias of the seal ring; and whereinat least one of the metal layers of the seal ring extends underneath atleast one antenna line of the antenna structure and further extends intothe scribe line.

BRIEF DESCRIPTION OF THE DRAWINGS

The characteristics and the advantages of the circuit, of the stackedstructure, of the package and of the testing system according to theinvention will be apparent from the following description of itsembodiments given by way of indicative and non-limiting example withreference to the annexed drawings.

In these drawings:

FIGS. 1A and 1B show, schematically and in greater detail, a testingapparatus of wafer integrated circuits according to the prior art;

FIG. 2 schematically shows a wafer comprising a plurality of integratedcircuits (chips) separated by scribe lines, according to the prior art;

FIG. 3 schematically shows a chip comprising at least one antennaaccording to the prior art;

FIGS. 4A and 4B schematically show a system RFId or Smart Card realizedaccording to the prior art;

FIGS. 5A and 5B show schematic portions of a first embodiment of anintegrated circuit comprising an integrated antenna;

FIGS. 6A and 6B schematically show the first embodiment of the circuitand its electric equivalent, respectively;

FIGS. 7, 8A, 8B, 8C, 9A, 9B, 10, 11A, 11B, 12A, 12B, 13A, 13B, 14A, 14B,15A, 15B, 16A, 16B, 16C, 17, and 18 schematically show furtherimplementations of the first embodiment;

FIG. 19 schematically shows a second embodiment of the circuit;

FIGS. 20 and 21 schematically show the second embodiment of the circuit;

FIGS. 22A, 22B, 22C, 22D, 23A, 23B, 23C, 24A, 24B, 24C and 24Dschematically show further implementations of the second embodiments;

FIG. 25 schematically shows a third embodiment of the circuit;

FIGS. 26A, 26B, 26C, 26D, 27A, 27B, 27C, and 27D schematically showfurther implementations of the third embodiment of the circuit;

FIG. 28 schematically shows a fourth embodiment of the circuit;

FIGS. 29A, 29B, 29C, 30A, 30B, 31A, 31B, 31C and 31D schematically showfurther implementations of the fourth embodiment of the circuit;

FIG. 32 schematically shows a testing system with wireless connection tothe circuit;

FIGS. 33, 34, 35A and 35B schematically show embodiments of the testingsystem of FIG. 32;

FIG. 36 schematically shows a stacked structure comprising at least onecircuit;

FIGS. 37 and 38 schematically show embodiments of the stacked structureof FIG. 36;

FIGS. 39 and 40 schematically show a package comprising the stackedstructure of FIG. 38; and

FIGS. 41 and 42 schematically show the package of FIGS. 39 and 40 in atesting step at the package level.

DETAILED DESCRIPTION

With reference to these figures, and in particular to FIGS. 5A and 5B, awafer of semiconductor material is globally and schematically shown, inparticular a portion thereof comprising at least one integrated circuit20.

It is to be noted that figures are not drawn to scale, but are insteaddrawn so as to underline the important characteristics of theembodiments. Moreover, in the figures, the different pieces are shown ina schematic way, and their shape may vary according to the desiredapplication.

Furthermore, elements or measures described by way of illustration withreference to an embodiment are not to be intended as limited thereto,the different features, structures and/or elements having thepossibility to be indifferently used in combination among the differentembodiments described.

The integrated circuit 20 comprises in particular at least oneperipheral portion 21 close to a scribe line 22 providing separationbetween the integrated circuits on the wafer. In its most general form,the integrated circuit 20 comprises at least one conductive structurethat extends in its peripheral portion 21 on different planes startingfrom a substrate 24 of the wafer and realizes an integrated antenna 30for the circuit.

In particular, in this peripheral portion 21, a plurality of firstconductive lines 33 are realized, in particular metallization lines,arranged on different planes starting from the substrate 24 to form theantenna 30 that surrounds the integrated circuit 20 itself.

According to an aspect, the plurality of first conductive lines 33 isflanked by a plurality of second conductive lines 23, so that pairs offirst and second conductive lines, 33 and 23, belonging to a same plane,are separated from each other, the planes being substantially parallelto the substrate 24 and developing perpendicularly starting therefrom ina vertical direction, considering the local reference of the figure. Inparticular, for simplicity of illustration, the terms “horizontal” and“vertical” will be used hereafter in the description for indicatingdevelopment directions being parallel to the substrate and perpendicularthereto, respectively, these terms not having to be intended in any wayas limiting of the invention.

More in particular, second conductive lines 23 belonging to differentplanes are suitably connected to each other by means of conductiveconnections 26, for example conductive vias, that developperpendicularly to these planes, to form a seal ring 25. A portion ofthe seal ring 25 is schematically shown in FIG. 5A and has asubstantially pillar structure, starting from the substrate 24.

In particular, in a first embodiment shown in FIG. 5B, the firstconductive lines 33 belonging to each plane form a coil of theintegrated antenna 30. A coil is connected to another one by means ofconductive connections, for example metallic vias, arrangedperpendicularly to the coil itself for connecting conductive lines 33belonging to different planes.

According to this aspect, the antenna 30 develops then in the verticaldirection, starting from the substrate 24 and inside the peripheralportion 21 of the integrated circuit 20 close to the scribe line 22.

It is to be noted that the antenna 30, positioned in correspondence withthe peripheral portion 21 of the integrated circuit 20, where the sealring 25 is already usually realized, does not introduce problemsregarding the routing of the internal signals of the integrated circuit20 itself, a suitable routing configuration being already provided giventhe presence of the seal ring itself.

Moreover, thanks to its vertical development inside this peripheralportion 21, the antenna 30 has a reduced area, thus overcoming theproblems met with different known solutions.

Alternatively, the first and second conductive lines, 33 and 23, may bepartitions of a same plurality of conductive lines realized in theperipheral portion 21 of the integrated circuit 20.

It is to be understood that FIG. 5B simply is the section along line BBof FIG. 5A, which is in turn the section along line AA of FIG. 5B.

According to another aspect, as shown in FIG. 6A, at least one pair offirst conductive lines 33, belonging to different but adjacent planes,considering a development direction perpendicular to the substrate, forexample a first pair of lines indicated with 33A in FIG. 6A, areconnected to each other by means of conductive connections 36, forexample metallic vias. Similarly, other pairs of first conductive linesbelonging to different but adjacent planes in the vertical direction,such as a second pair of lines indicated with 33B in FIG. 6A, may beconnected to each other in a similar way with respect to the first pairof lines 33A by means of similar conductive connections 36. According tothis embodiment, the connection of pairs of lines belonging to differentbut adjacent planes, i.e. pairs of conductive paths of the antenna 30,reduces their series resistance Rs, as it is clear from the circuitequivalent model of the antenna 30 shown in FIG. 6B, being well known tothe skilled in the art. It is to be noted that, by creating an antenna30 that develops in the vertical direction, the parasite effects of theantenna 30 itself with the substrate 24 are reduced.

The first conductive lines 33 of the antenna 30 are formed by knownconductive materials such as for example metal and/or polysilicon orother.

According to an aspect, the seal ring 25 comprises conductive linesrealized in a traditional way by means of layers or metallic layersinterconnected by vias. In this case it is possible, without usingadditional layers, to realize also the antenna 30 thanks to the metalliclayers of the realization process of the seal ring 25, these metalliclayers forming both the first and the second conductive lines, 33 and23.

According to an aspect of the invention, the seal ring 25 comprises atleast part of the conductive lines 23 realized by materials havingmagnetic features, such as, for example, nickel and cobalt orcorresponding alloys.

In an alternative embodiment, shown with reference to FIGS. 7, 8A, 8Band 8C, the seal ring 25 comprises a plurality of single pillarstructures 27, for example uniformly distributed in the peripheralportion 21 of the integrated circuit 20, each one being formed by secondconductive lines 23 connected by means of vertical conductiveconnections 26.

According to an aspect, the first conductive lines 33 that form theantenna 30 are suitably sized so as to form serpentines 37 thatalternatively surround on the right and left the single pillarstructures 27 comprised in the seal ring 25, as shown in the sectionviews of FIGS. 8A, 8B and 8C.

In this way, the first and second conductive lines, 33 and 23, belongingto a same plane, create structures that are similar to the texture andto the warp of fabrics, as schematically shown in the plan view of FIG.7. In particular, as it may be appreciated in this figure, in theperipheral portion 21 of the integrated circuit 20 that surrounds anactive area 20A thereof a kind of ring is realized that comprises theantenna 30 formed by the serpentines 37 that surround the pillarstructure 27 of the seal ring 25.

Suitably, reinforced pillar structures 28 of the seal ring 25 arearranged in correspondence with the angles of the peripheral portion 21of the integrated circuit 20. In particular, these reinforced pillarstructures 28 are realized by means of portions of second conductivelines 23 and vertical conductive connections 26 of greater sizes withrespect to the corresponding elements being used for realizing thepillar structure 27 of the seal ring 25 arranged inside the serpentines37 that form the antenna 30.

It is in fact well known that the area in correspondence with the anglesof the peripheral portion 21 of the integrated circuit 20 is subjectedto the greater mechanical efforts during the cut or singulation of thecircuit itself from the wafer it is integrated in.

According to another aspect, each pillar structure 37 may be suitablybiased, for example with a connection to a ground reference or to apositive or negative voltage, according to the needs.

It is to be noted how, according to this embodiment just described, theserpentines 37 that form the antenna 30 and that, in an alternated way,pass on the right and then on the left of the pillar structure 27 thatforms the seal ring 25 in turn mechanically reinforce the structure ofthe whole integrated circuit 20.

Moreover, with respect to the case in which the antenna 30 is realizednext to the seal ring 25, according to this alternative embodiment, anantenna 30 is obtained that occupies a further reduced area, which has alow impact on the overall size of the integrated circuit 20.

According to a further alternative embodiment, the antenna 30 is formedby first conductive lines 33 shaped in a substantially alveolar form, orchains-like 37′. In particular, as schematically shown in the sectionviews of FIGS. 9A and 9B, the chains 37′ that form the antenna 30surround the pillar structure 27 that forms the seal ring 25. It isclear that this further embodiment, besides occupying a reduced area,further strengthens from the mechanical viewpoint the structure of thewhole integrated circuit 20 also with respect to the embodimentspreviously described.

Suitably, for reducing the capacitive coupling of the antenna 30 withthe substrate 24, it is possible to realize therein, in correspondencewith the seal ring 25 and with the antenna 30, an inversely biasedjunction PN, able to reduce the capacity of junction towards thesubstrate 24. In particular, as schematically shown in FIG. 10, a well24′ is realized in the substrate 24 in correspondence with the seal ring25 and with the antenna 30. More in particular, the well 24′ is placeddirectly below the seal ring 25 and in contact with its verticalconductive connections 26′ contacting the substrate 24 and extends alsoin correspondence with the antenna 30. This well 24′ is doped in acomplementary way with respect to the substrate 24 so as to form aninversely biased junction PN, indicated with Dsub in the figure. In thecase, for example, of a substrate 24 of the P type, the well 24′ will besuitably of the N type and obviously in the case of a substrate 24 ofthe N type, the well 24′ will be of the P type.

Although in FIG. 10 a seal ring 25 and an antenna 30 according to theembodiment shown in FIG. 9A are represented, it is obviously possible torealize a junction Dsub formed by the well 24′ and by the substrate 24also in the case of the other embodiments, as described previously andhereafter.

As already described in relation to the prior art, when an inductiveantenna realized on a more or less conductive substrate is invested byor produces a magnetic field H, the so called eddy currents aregenerated in the substrate itself, these currents disadvantageouslyopposing against the variation of the flow of the magnetic field itself,and whose effect reduces the performance of the antenna itself.

It is also known that the effect of these eddy currents is greaterinside the antenna, since the force lines of the magnetic field H mostlyconcentrate there. The eddy currents also concentrate in a surface areaof the substrate whereon the antenna is realized and their valuedecreases exponentially for the so called skin effect along thedirection of penetration inside the same substrate.

It is also known that the effect of these eddy currents is emphasized inthe seal ring realized exactly in the classic mode since it offers anelectric resistance that is orders of magnitude lower than that of thesubstrate.

It is to be understood that the realization of the seal ring 25 by meansof one or more pillar structures reduces the effect of these eddycurrents, substantially thanks to the partition of the second conductivelines 23.

According to an aspect, as schematically shown in FIGS. 11A and 11B, forfurther reducing the eddy currents caused by a magnetic field H thatinvests or is produced by the antenna 30, in particular in the surfacearea of the substrate 24, the integrated circuit 20 is provided withsuitably doped areas 31 similar to doped fingers realized in thesubstrate 24 so as to extend in part inside and in part outside theintegrated circuit 20 itself, substantially across its peripheralportion 21 where the antenna 30 is realized. In this way, these suitablydoped areas 31 form a junction PN that hinders the circulation of theeddy currents, indicated with Iec, lengthening the flowing path of thesecurrents Iec, dot-lined in FIG. 11A.

In particular, in the case in which under the antenna 30 and in thesubstrate 24, for example of the P type, the well 24′ is realized, forexample of the N type, for hindering the eddy currents Iec, it isnecessary to interrupt exactly the well 24′ at least in a section orportion thereof in correspondence with and underlying the same antenna30, this interruption being realized avoiding to create exactly the well24′ in this section or portion, creating interruptions indicated with 32in the figure.

It is also possible that the interruption 32 has been created by using atrench under the antenna 30 and in the substrate 24, in particular thetrench may be filled in with insulating material, such as oxide,realized still across the peripheral portion 21 where the antenna 30 isformed for interrupting the well 24′ and hindering the circulation ofthe eddy currents Iec. Also other microelectronic structures present onthe surface of the substrate 24 may hinder at least in part the eddycurrents Iec.

In an alternative embodiment, at least one pillar structure of the sealring 25 may be used for realizing a contact terminal or pad 40, anopening OP being realized in correspondence with it, as schematicallyshown in FIG. 12A.

The pad 40 thus obtained may be used as contact terminal for theintegrated circuit 20 and/or for possible structures TEG being in thescribe line 22, also realizing a common pad of the integrated circuit 20and these structures TEG.

The pillar structure that realizes the pad 40 comprises in this case atleast one conductive line 23A that extends up to the scribe line 22and/or at least one conductive line 23B that extends up to the activearea 20A of the integrated circuit 20.

It is in this way possible to realize at least one part of the pad ofthe integrated circuit 20 (part of the so called pad ring) close to thescribe line 22, in correspondence exactly with the seal ring 25, nowsuitably partitioned.

In this respect, it is suitable to underline how the pads the integratedcircuits 20 are usually provided which have, in general, sizes and inparticular width greater than a corresponding size of the traditionalseal ring 25. More in particular, against a seal ring 25 of widthnormally equal for example to 10 μm, the pads usually have length equalfor example to at least 50 μm. The realization of part of the pads ofthe integrated circuit 20 in the peripheral portion 21 where the sealring 25 is already realized however reduces the area globally occupiedby the integrated circuit 20 on the wafer, with an evident economicadvantage.

Alternatively, by realizing at least one part of the pads of thestructures TEG in the peripheral portion 21 where the seal ring 25 isrealized thanks to metallization lines 40A that are connected to thestructures TEG and, by means of suitable conductive connections 40′, tothe conductive line 23A of the pads 40, it is possible to actuallyreduce the size of the scribe line 22 and in consequence the problemslinked to the sawing of the wafer during the assembling step, theseproblems being in part caused exactly by the presence of the pad of thestructures TEG in the scribe line 22, where the saw that executes thepartition or singulation of the integrated circuits or chips is to beactivated.

In this case, the structures TEG are suitably connected to the pad 40realized in the peripheral portion 21 of the integrated circuit 20 wherethe seal ring 25 is realized by means of measures placed near the pillarstructure that forms this pad 40, so that the (lateral) mechanicaleffort during the action of the sawing does not damage the pad itself.

In particular, it is possible to connect the structures TEG to the pad40 by simply interrupting the metallization line 40A with at least oneconductive via that realizes a conductive connection 40′ and makes theconnection of the structure TEG to the pad 40 more fragile. In this way,the sawing action in the scribe line 22 damages the conductive pathexactly in correspondence with the via of connection 40′ to themetallization line 40A, in turn connected to the structures TEG,avoiding instead the damage of the pillar structure that realizes thepad 40.

Moreover, according to an aspect, a junction PN realized in thesubstrate 24 thanks to a well 24′ of opposed doping with respect to thesubstrate 24 itself, as previously described, is used for reducing thecapacitive coupling of the antenna 30 with the substrate itself. In analternative embodiment, this junction PN is suitably divided into moreparts, one of which is used for realizing a diode of protection againstthe electrostatic discharges or ESD (acronym from the English:“ElectroStatic Discharges”) of the pad 40, as schematically shown inFIG. 12B, this protection diode ESD being indicated as Desd.

According to another aspect, it is possible to use different conductivelines 33 for realizing more than one antenna, for example obtaining atransformer 38, as schematically shown in FIGS. 13A and 13B.

In particular, in these figures, a first antenna 37A is realized byfirst conductive lines 33 arranged on different but adjacent planes andsuitably connected to each other to realize a first coil. Similarly, asecond antenna 37B is realized by first conductive lines 33 arranged ondifferent but adjacent planes and suitably connected to each other torealize a second coil.

It is also possible to realize the first and second antennas, 37A and37B, of the transformer 38 by using more conductive lines 33 belongingto different but adjacent planes and suitably connected to each other,as schematically indicated in FIG. 13B, the first and second antennas,37A and 37B, of the transformer 38 comprising in this case, by way ofillustration, a pair of conductive lines 33.

It is obviously possible to divide the first conductive lines 33 thatrealize the antenna 30 into more parts, obtaining coplanar coils thatmay be connected to each other in different modes. It is also possibleto realize the antenna 30 by means of more conductive lines flanked on asame plane, creating conductive paths that may be connected to eachother in series or in parallel, also with respect to the overhanging andunderlying planes.

In this way, it is possible, for example, to increase the number of thecoils comprised in the antenna 30 or to realize more different antennas.In the case of realization of resonant antennas, they will also have thepossibility to be made resound at the same frequency or at differentfrequencies. Moreover, it is possible to provide the presence of atleast one antenna inside the integrated circuit 20 and in particular ofits active area 20A.

Obviously, the different antennas realized by the conductive lines 33may have a different shape with respect to one another, the shape havingnot to be considered, in no way, as limitative of the invention. In asimilar way, also the shape of the pillar structure 27 that forms theseal ring 25 is supplied by way of indication and is not to beconsidered as limitative of the invention.

FIGS. 14A, 14B, 15A, 15B, 16A, 16B, 16C, 17, 18 and 19 show differentgeometric shapes relative to the antenna 30 and to the seal ring 25realized according to the invention.

According to an aspect, two pillar structures 27 may be connected bymeans of at least one intermediate conductive line 41A, as shown inFIGS. 14A and 14B. This intermediate conductive line 41 is connected tothe other conductive lines 23 that form the pillar structure 27 alwaysby means of vertical conductive connections 26. In the example shown inthese figures, the antenna 30 is formed by means of serpentines 37 thatcurl alternatively on the right and on the left of the pillar structure27 and the seal ring 25 comprises two intermediate conductive lines 41arranged between serpentines 37 realized in different planes. Obviously,these intermediate conductive lines 41 (and the relative verticalconductive connections 26) contribute to mechanically strengthening thestructure of the seal ring 25 as a whole.

It is to be understood how, in changing the geometries of the seal ring25 and of the antenna 30, and in particular of the conductive lines 23and 33 composing them, particular attention should be paid not to createclosed circular paths, to avoid the arising of the eddy currents, aspreviously explained.

According to another aspect, the seal ring 25 comprises a conductiveline realized above the pillar structure 27 and having greater sizeswith respect to the remaining second conductive lines 23 that realizethis pillar structure 27, as schematically shown in FIGS. 15A and 15B.In particular, the upper conductive line 42, that ensures the mechanicalstrengthening of the pillar structure 27 as a whole, may be in this caseused for realizing a pad 40, crossed by at least one part of the antenna30, as shown in FIG. 15B. Also in this case, an opening OP should berealized in correspondence with the pillar structure 27 for letting theupper conductive line 42 surface and thus realize the pad 40.

According to another aspect, the antenna 30 comprises linear elements35, as schematically shown in FIGS. 16A, 16B and 16C, in the case inwhich at least one pillar structure 27 of the seal ring 25 comprises anupper conductive line 42 suitable for realizing a pad. In this case, thelinear element 35 of the antenna crosses by pillar structures 27 of theseal ring 25, in particular below the upper conductive lines 42 of thosestructures 27 that realize the pad 40.

Also in this case, suitable measures, like the provision of inverselybiased junctions PN, should be taken for avoiding that parasite currentsare formed due to the magnetic field in the pillar structure 27 of theseal ring 25, as schematically shown in FIG. 17. In particular, suitablewells 24′ and 24″ are provided in the substrate 24 in correspondencewith the pillar structures 27 of the seal ring 25, these pillarstructures 27 being connected to each other by means of an upperconductive line 42 to realize a pad 40. Moreover, as previously seen,the pads 40 realized by the pillar structures 27 provided with an upperconductive line 42 may be used for the integrated circuit 20 and/or forpossible structures TEG being in the scribe line 22.

According to another embodiment, the antenna 30 is realized in a socalled loop formed by a single coil 30A realized by the conductive lines33 of all the planes interconnected to each other by conductiveconnections 36, in a substantially wall-like structure, as schematicallyshown in FIG. 18. It is to be understood how the connection between theconductive lines 33 that realize the antenna 30 strengthens itsstructure as a whole. In the case shown in the figure, also theconductive lines 23 that form the pillar structures 27 of the seal ring25 are all interconnected to each other on the different planes byrespective conductive connections 26. In particular, in the case shownin the figure, at least one pillar structure 27 is provided with anupper conductive line 42 emerging through an opening OP to realize a pad40, in turn particularly strong thanks to the interconnections of thesecond conductive lines 23 of the pillar structure 27 that realizes it.

The single pillar structures 27 as well as the pads 40 formed therebymay comprise materials having magnetic features. In particular, theupper conductive line 42 of the pad 40 will be advantageously realizedby using materials having conductive and magnetic features, such as forexample nickel or cobalt or corresponding alloys, which will have highhardness for further and mechanically reinforcing the seal ring 25.

A second embodiment is schematically shown with reference to FIG. 19.

In particular, the integrated circuit 20 comprises at least one firstplurality of conductive lines 51 that surround its active area 20A inits peripheral portion 21 in correspondence with the scribe line 22 andrealize the antenna 30, as well as a second plurality of conductivelines 52, still realized in its peripheral portion 21 so as to surroundits active area 20A to form the seal ring 25. Also in this case, as seenfor the previous embodiment, the conductive lines belonging to differentplanes are suitably connected by means of conductive connections, theseal ring 25 and the antenna 30 having a vertical development in thescribe line 22 starting from the substrate 24 of the integrated circuit20 itself, as previously seen.

More in particular, the first plurality of conductive lines 51 isinterrupted in correspondence with a first cutting area, indicated withC1 in the figure, each conductive line 51 arranged in a plane thusforming a coil of the antenna 30. Terminal portions of the conductivelines 51 in correspondence with the first cutting area C1 realize theterminals (feed), T1 and T2, of the antenna 30. In the example shown inFIG. 19, the first plurality of conductive lines 51 is arrangedinternally with respect to the second plurality of conductive lines 52,substantially near an active area 20A of the integrated circuit 20.

Suitably, also the second plurality of conductive lines 52 isinterrupted in correspondence with a second cutting area, indicated withC2 in the figure.

According to an aspect, the second cutting area C2 of the secondplurality of conductive lines 52 is in an opposite position with respectto the first cutting area C1 of the first plurality of conductive lines51, and in particular of the terminals T1 and T2 of the antenna 30. Inthis way, it is possible to solve the problems of parasite coupling ofthe seal ring 25 arranged outside the antenna 30, avoiding at the sametime that polluting substances could penetrate into the integratedcircuit 20 at the or after the cutting or singulation of the same fromthe wafer in which it is realized.

According to alternative embodiments shown in FIGS. 20 and 21, theintegrated circuit 20 comprises at least one further plurality ofconductive lines 53 interrupted in correspondence with a further cuttingarea, indicated with C3 in the figure, to form a further seal ring 25′.Also the conductive lines 53 belonging to different planes are suitablyconnected by means of conductive connections, the further seal ring 25′having a vertical development in the scribe line 22 starting from thesubstrate 24 of the integrated circuit 20 itself.

In particular, as shown in FIG. 20, the further seal ring 25′ may beplaced inside the first plurality of conductive lines 51 that form theantenna 30, the cutting area C3 of the further plurality of conductivelines 53 being positioned in correspondence with the first cutting areaC1 of the first plurality of conductive lines 51 for allowing thepassage of the terminals T1 and T2 of the antenna 30.

Alternatively, as shown in FIG. 21, the further seal ring 25′ may bepositioned between the antenna 30 and the seal ring 25. The seal ring 25is in particular indicated as external and the further seal ring 25′ asinternal.

In this case, according to an aspect, the further cutting area C3 of thefurther plurality of conductive lines 53 that form the internal sealring 25′ is placed so as not to be aligned to the second cutting area C2of the second plurality of conductive lines 52 that form the externalseal ring 25.

It is to be understood the fact that, even if suitably interrupted inthe cutting areas C1 and C3, the internal and external seal ring, 25 and25′, however maintain a good mechanical resistance, the nonalignedpositioning of the interruptions in correspondence with these cuttingareas hindering moreover the infiltration of polluting substances.

Furthermore, with a suitable sizing of the conductive lines that formthem, it is possible to realize an overall seal ring and antennastructure with space that may be compared to that of the seal ringsrealized according to the prior art.

According to an alternative embodiment, the first plurality ofconductive lines 51 that form the antenna 30 are in this casesubstantially L and/or T-shaped and overhang at least in part the secondplurality of conductive lines 52 that form the seal ring 25, asschematically shown in FIGS. 22A and 22B. Moreover, the seal ring 25and/or the antenna 30 may comprise structures realized by means ofsuitable vertical conductive connections between the respectivepluralities of conductive lines, 52 and 51, as schematically shown inFIGS. 22C and 22D. In FIG. 22A the conductive lines 51 of the firstplurality are internal and the conductive lines 52 of the secondplurality are external, also the opposed situation with the conductivelines 51 external and the conductive lines 52 internal being obviouslypossible.

According to further embodiments, the antenna 30 may be realized so asto overhang at least in part the second plurality of conductive lines 52that form the seal ring 25 and/or the further plurality of conductivelines 53 that form the further seal ring 25′, possibly comprisingrespective structures realized by means of suitable vertical conductiveconnections between the respective plurality of conductive lines 51, 52and 53, as schematically shown in FIGS. 23A-23C and 24A-24D.

It is to be understood how these alternative embodiments allow to reducethe space of the antenna 30 and consequently the silicon area used andthat the structures described may be realized by using a standardprocess flow for the integration of circuits on wafer.

Besides the advantages already understood in terms of area occupation,the alternative embodiments just described allow to reduce the seriesresistance Rs of the antenna 30 with a consequent increase of itsquality factor Q.

According to an aspect, an accurate identification of the overlappingareas between the antenna 30 and seal ring 25 and/or 25′ allows todetermine with a high accuracy degree the parasite capacities of theseelements towards the substrate 24 whereon the integrated circuit 20,that comprises them, is realized.

In a third embodiment, shown schematically in FIG. 25, in the peripheralportion 21 of the integrated circuit 20 adjacent to the scribe line 22at least one conductive line 33 is realized, that forms the antenna 30.According to this embodiment, a trench structure 60 is suitably realizedin a central portion 22A of the scribe line 22 that separates a firstand a second integrated circuit 20 and 20′, as schematically shown inFIG. 26A. In this case, as it will be better clarified hereafter in thedescription, the integrated circuit 20 does not comprise any seal ring.

In fact, the trench structure 60 is realized so as to penetrate at leastinto the depth of the substrate 24, creating a housing area of thecutting tools for the singulation of the integrated circuits 20, thissingulation interesting only the substrate 24 and thus not requestingthe presence of a seal ring to protect the integrated circuit 20.Moreover, the singulation operation does not risk in this way to damagethe antenna 30.

This trench structure 60 may be obtained by simply avoiding to depositmaterial at least in the central portion 22A of the scribe line 22.Alternatively, when during the process of manufacturing of theintegrated circuit 20 oxides, dielectrics or insulating materials aredeposited in the scribe line 22, it is possible to realize the trenchstructure 60 by means of a suitable masking and etching process forremoving the greater part of the material present in the scribe line 22.

More in particular, the trench structure 60 may be covered by aprotective layer 61, for example a passivation layer, that protects theintegrated circuit 20 hindering the infiltration of pollutingsubstances, as schematically shown in FIG. 26B. It is to be noted thatthe normal manufacturing flows of integrated circuits comprise thedeposition of an upper passivation layer, that could be deposited alsoon the side and bottom walls of the trench structure 60, withoutrequesting the addition of dedicated process steps.

Furthermore, the trench structure 60 may be realized so as to penetrateat least partially into the substrate 24, further reducing the stressescaused by the singulation operation of the integrated circuits, thistrench structure 60 being possibly provided with the protective layer61, as schematically shown in FIG. 26C.

At the end of the singulation operation, each integrated circuit 20comprises in its peripheral portion 21 next to a cutting area CT part ofthe trench structures 60 here indicated with 60′, next to the integratedantenna 30 in this peripheral portion 21, as schematically shown in FIG.26D, where by way of simplicity the protective layer 61 is notindicated.

The antenna 30 may be realized also by means of a plurality ofconductive lines 33 arranged on parallel and distinct planes startingfrom the substrate 24 and suitably connected to each other as previouslyseen.

According to an aspect of the invention, the conductive paths realizedby the conductive lines 33 of the antenna 30 may be also out ofalignment with respect to one another for reducing their capacitivecoupling, as schematically shown in FIG. 27A.

Moreover, the conductive lines 33 that form the antenna 30 may havedifferent geometric shapes according to the needs.

More in particular, as non-limitative examples of the invention,conductive lines 33 will be used with a substantially S-like andpossibly tapered profile, as schematically shown in FIG. 27B, with asubstantially L-like profile, as schematically shown in FIG. 27C,possibly with contact points PC between at least one pair of conductivelines 33, as schematically shown in FIG. 27D, in this case avoiding touse vias for the connection of the conductive lines 33 that form theantenna 30 and belong to different planes.

It is to be noted that, in the case of conductive lines 33 with asubstantially L-like profile, the side portion of these lines, arrangedperpendicularly to the substrate 24, may be realized during the etchingprocess used for creating the vias present in the integrated circuit 20,in this case used for substantially creating a trench then filled inwith the material of the conductive lines 33.

According to an alternative embodiment, the conductive lines 33 may havealternated L-like profiles.

It is to be understood how the different geometric shapes used for theconductive lines 33 are able moreover to strengthen the peripheralportion 21 of the integrated circuit 20 and hinder the pollution byexternal substances, also succeeding in reducing the area occupation ofthe antenna 30 as a whole.

In a fourth embodiment, shown schematically in FIG. 28, in theperipheral portion 21 of the integrated circuit 20 adjacent to thescribe line 22 at least one antenna 30 comprising a single coil isrealized. In particular, as schematically shown in FIG. 29A, in theperipheral portion 21 a trench structure 65 suitably coated by at leastone layer 63 of conductive material to form the coil of the antenna 30is realized.

The remaining part of the trench structure 65 may be left empty orfilled in with a nonconductive filling material 64, such as for examplean insulating material, in particular an oxide, or passivating thesurface in a similar way with respect to the protective layer 61 of FIG.26B.

The coil formed in this way has thus a substantially V-like profile (orU-like). According to an aspect of the invention, above the fillingmaterial 64 a further conductive material 63′ may be present to formanother coil of the antenna 30, as schematically shown in FIG. 29B.

According to another aspect, the antenna 30 is formed inside the trenchstructure 65 by means of a plurality of layers 63 of conductivematerial, suitably and substantially V-like shaped (or U-like), arrangedat different levels with respect to the substrate 24 and separated by aconductive material, the trench structure 65 being possibly completelyfilled in with the nonconductive filling material 64, as schematicallyshown in FIG. 29C. The layers 63 may be suitably connected to each otherin a similar way with respect to what has been previously seen.

It is to be noted how, also in this case, the antenna 30 may have alsothe function of seal ring.

According to an embodiment, schematically shown in FIGS. 30A and 30B,between the conductive paths of the antenna 30 support structures 66 areprovided suitable for mechanically strengthening the antenna 30 as awhole.

These support structures 66 may be realized by means of vias filled inwith an insulating material, or by means of vias comprising an externalinsulating layer and filled in at least in part with a conductivematerial, for example the same conductive material that realizes theantenna 30, the external insulating layer being such as to avoid thatdifferent paths of the antenna 30 are in short circuit.

According to an aspect, the insulating material may also have magneticfeatures, or contain magnetic particles dispersed therein so as toincrease the quality factor of the antenna 30.

In the case in which the antenna 30 comprises different levels of aconductive material, conductive connections 36 are also provided, forexample conductive vias, that connect these different levels, asschematically shown in FIG. 30B.

Alternatively, it is possible to realize the support structures 66 bymeans of trenches realized along the conductive paths of the antenna 30,these trenches having characteristics similar to the nonconductive vias.Also in this case, moreover, conductive connections 36 may be providedbetween different levels of conductive material that realize the antenna30.

In an embodiment, under the area where the antenna 30 is realized, theTSV (Through Silicon Vias) could be provided, filled in with aninsulating material (instead of a conductive material) such as forexample an oxide or dielectric. Alternatively it is also possible tocreate at least one trench filled in with an insulating material ordielectric.

This measure allows reducing the parasitic effects between the antenna30 and the substrate 24, increasing in consequence the quality factor Qof the antenna 30 itself.

Naturally, the insulating trench may extend also in part of the areanear the antenna 30.

According to a further aspect, it is possible to create at least onestructure having magnetic features around the antenna 30.

In particular, in this case the integrated circuit 20 comprises at leastone trench comprising in turn at least one material having magneticfeatures realizing a magnetic trench 70. More in particular, asschematically shown in FIG. 31A, the magnetic trench 70 comprises alateral coating portion 67 realized in a magnetic material and filled inwith a filling material 67A, for example an insulator. The magnetictrench 70 is in this case however an insulating trench (laterally coatedwith a magnetic material).

According to alternative embodiments, it is possible:

-   -   to create at least two magnetic trenches 70 being only laterally        with respect to the antenna 30, a further insulating trench 68        being realized below the antenna 30 and below these magnetic        trenches 70, as shown in FIG. 31A, or    -   to realize the two magnetic trenches 70 with a magnetic material        69 that extends also in the further insulating trench 68 below        the antenna 30, as schematically shown in FIG. 31B.

In an alternative embodiment not shown, the trench 68 filled in with aninsulating material may be replaced by TSV filled in with an insulatingmaterial.

The presence of at least one magnetic trench 70 between the integratedcircuit 20 and the antenna 30 allows reducing the influence of themagnetic field on the circuits comprised in the integrated circuit 20itself. Further, it is suitable to empty at least in part the scribeline 22 for avoiding damages for the antenna 30 during the cuttingoperations.

It is to be understood the fact that, in case of realization of at leastone magnetic trench 70 between the scribe line 22 and the antenna 30, itis advantageously possible to use a magnetic material having suitablemechanical characteristics, for example a hard material such as nickelor its alloys, for protecting the antenna 30 during the operations ofsingulation of the integrated circuit 20 from the wafer wherein it isrealized. The magnetic trench 70 advantageously executes in this wayalso the strengthening function normally carried out by the seal ringand the scribe line 22 may also be not emptied. In this case in fact,even if no seal ring is realized, the magnetic trench 70 allows tostrengthen the structure of the integrated circuit 20 as a whole and toallow its singulation also in case of a scribe line 22 filled in with amaterial.

It is also possible to create composite structures formed by acombination of insulating trenches and of magnetic trenches 70A, inparticular around the antenna 30 and inside or around the insulatingtrench 68 being realized in the substrate 24, as schematically shown inFIGS. 31C and 31D.

In particular, further magnetic trenches 70A may be realized belowmagnetic trenches 70 formed by the magnetic material 69 with asubstantially bow-like structure and inside the further insulatingtrench 68, as schematically shown in FIG. 31C.

Alternatively, the magnetic material 69 may realize the magnetictrenches 70 laterally with respect to the antenna 30 and coat laterallyalso the further insulating trenches 68 realized in the substrate 24,thus obtaining a further magnetic and insulating trench 70A.

It is to be understood that, if the magnetic material used for realizingat least laterally the trenches 70 and/or 70A also has conductivecharacteristics, these trenches will be interrupted in at least onesection so as to avoid the creation of closed paths where the eddycurrents may flow.

It is also possible to replace at least in part the magnetic trenches70A by means of deep vias laterally coated with a magnetic material andpossibly filled in with a filling material. In this case it is possible,by using a magnetic material having conductive characteristics, to usethese deep magnetic vias for connecting at least two conductive pathsplaced in different planes to each other.

The same thing may be done also by suitably dividing into parts amagnetic trench, still realized with a magnetic material havingconductive characteristics.

According to an alternative embodiment, magnetic TSVs may also becreated under the antenna 30.

It is thus possible to optimize the performances of the antenna 30 andto mechanically strengthen the peripheral portion 21 of the integratedcircuit 20, by creating composite structures suitably combining theelements comprised in a group or sub-group of structures like: at leastone insulating trench, at least one insulating TSV, at least onemagnetic trench, at least one insulating via, at least one magnetic via,at least one magnetic TSV.

In conclusion, advantageously according to embodiments, an integratedcircuit 20 is obtained provided with an antenna 30 being integratedtherein.

This integrated circuit 20 will then communicate with other devices orsystems through electromagnetic waves for exchanging information andpossibly it will also be supplied, at least in part, by the energy ofthese electromagnetic waves. Similarly, the integrated circuit 20 wouldbe able to supply other devices or systems thanks to the energy of theelectromagnetic waves exchanged through the integrated antenna 30.

For the testing of this integrated circuit 20 on a wafer a probe cardcould be used suitably modified so as to comprise a traditional probehead, as well as at least one suitable test antenna. More in particular,it is possible to realize this test antenna through a printed circuit orPCB realized on at least one flexible substrate, fixed or not to theprobe head but however connected to the probe card and thus to thetester ATE. It is possible for example to use a substrate in Kapton,material that may sustain high temperatures and make it thus possiblethe testing of the integrated circuit 20 in temperature.

It is to be noted that, thanks to the presence of the antenna 30integrated on the circuit 20 and of the test antenna the probe card isprovided with, it is possible to create at least one wirelesscommunication channel, in particular between these two antennas.

More in particular, as schematically shown in FIG. 32, a testing system,globally indicated with 100, comprises the integrated circuit 20provided with its antenna 30 and in wireless communication, inparticular by means of electromagnetic waves EW, with a probe card 80,comprising at least one probe head 82 and provided in turn with a testantenna 90.

More in detail, FIG. 33 shows such a testing system 100 comprising aprinted circuit 81 to which the probe head 82 is connected and in turnconnected to a tester ATE 101 of the system 100.

Suitably, the probe card 80 comprises at least one substrate 83 of aflexible material, for example of a material suitable for therealization of printed circuits, associated with the probe head 82. Morein particular, the flexible substrate 83 comprises at least one firstand one second flexible extension, 84A and 84B, positioned between theprobe head 82 and the printed circuit 81 and connected for example bymeans of electric extensions to the printed circuit 81 itself. If aflexible substrate is fixed to the probe head 82 there may be presentalso a sole flexible extension, for example the first flexible extension84A, for electrically connecting the test antenna 90 to the printedcircuit 81. If a flexible substrate is not fixed to the probe head 82 atleast two flexible extensions 84A and 84B should be present forelectrically connecting the test antenna 90 to the printed circuit 81,and the antenna 90 is floating between the probe head 82 and the wafer,thus approaching the wafer itself and in particular the antenna 30 ofthe integrated circuit 20. In consequence the antenna 90 may possiblysupply energy to the integrated circuit 20, allowing its operationbesides its communication.

Alternatively, a further rigid PCB (not shown in the figure), providedwith suitable connectors, could connect the flexible substrate 83 to theprinted circuit 81 of the probe card 80 (and thus to the tester ATE 101)for allowing to disassemble the probe card 80 in its various parts andhaving the possibility to repair it.

According to an aspect, in the flexible substrate 83 at least one testantenna 90 is realized, substantially positioned in correspondence withthe antenna 30 of the integrated circuit 20, in this way the twoantennas face each other and may realize the desired wirelessconnection. In particular, it is to be noted how the realization of theprobe card 80 provided with a test antenna 90 and having sizessubstantially corresponding to those of a traditional probe card is madepossible by the use of an integrated circuit 20 provided with an antenna30 with a substantially vertical development. In this way the probe card80 may be used in a testing system 100 compatible with the technologiesalready used in the field of testing of integrated circuits on wafer.

The probe card 80 also comprises at least one probe 85 that extends fromthe probe head 82 and crosses the flexible substrate 83 for electricallycontacting a corresponding pad of the integrated circuit 20. It is to benoted how this probe 85 creates a physical or cabled communicationchannel, indeed, while a wireless communication channel is realizedthanks to the antennas 30 and 90.

The integrated circuit 20 is realized in a wafer, in particular in asubstrate 24 of this wafer, that during the test is usually arranged ona mechanical support 102 of the testing system 100, in particular theprober chuck.

More in particular, in the example shown in FIG. 33 by way ofindication, the integrated circuit 20 comprises at least one magnetictrench 70 that includes a lateral coating portion 67 realized in amagnetic material and is filled in with an insulator 68 and with afilling material 67A, also for example an insulator, wherein the antenna30 is realized. Advantageously, the magnetic material may create apreferred path for allowing the force lines of the field between theantennas 30 and 90 to close themselves.

Suitably, in a further embodiment, the test antenna 90 is formed bymeans of a plurality of conductive lines 91 realized in the flexiblesubstrate 83, in a similar way with respect to the antenna 30 of theintegrated circuit 20.

In a general way, this test antenna 90 realized in the flexiblesubstrate 83 of the probe card 80 may be provided outside the probes 85and/or inside them.

It is to be noted that, if the probes 85 are placed in an inner area ofthe antenna 30 of the integrated circuit 20, they may also have magneticfeatures, and in particular:

-   -   the probes 85 may be covered by magnetic materials; or    -   the probes 85 may be realized with materials that have both        electric features and magnetic features;

In fact, in this case the magnetic field is greater in the inner area ofthe antenna 30 and next to the antenna 30 itself, that may besubstantially a solenoid.

In this case, the probes 85 will perform both an electric function ofconnection of the tester ATE 101 with the integrated circuit 20 and amagnetic function, improving the coupling between the test antenna 90and the antenna 30 of the integrated circuit 20.

According to another aspect, for improving the performances of thetesting system 100, increasing for example the transmission frequency,it is possible to realize an active probe card 80 obtained by insertingan integrated test circuit 87 in a suitable seat, in particular a cavity86 realized in the probe head 82, where the integrated test circuit 87itself, that will be connected to the flexible substrate 83, iscomprised as schematically shown in FIG. 34. It is to be understoodagain that this figure is not in scale, in particular the sizes of theintegrated test circuit 87 and of the integrated circuit 20 areobviously out of scale.

More in particular, the integrated test circuit 87 comprises suitablecircuits of transmission and reception and possibly coding and decodingof the signals exchanged between the probe card 80 and the integratedcircuit 20.

Also in this case, it is understood how the integrated test circuit 87could be placed outside an array of probes 85, or inside the same, andpossibly also outside the probe head 82.

According to another aspect, in the case of integrated circuits 20 ofthe low power type, wherein it is possible to avoid the use of theprobes 85 for the supply of these circuits, the testing system 100comprises an antenna card 88 directly associated with the tester ATE101, as schematically shown in FIG. 35A. This antenna card 88particularly comprises a substrate 89 wherein the test antenna 90 isrealized, in particular by means of a plurality of conductive lines 91,this antenna 90 being realized so as to substantially face incorrespondence with the antenna 30 of the integrated circuit 20, so asto realize the desired wireless connection. The substrate 89 of theantenna card 88 will be in turn of a material suitable for themanufacturing of printed circuits, the antenna card 88 being thus in theform of a board PCB.

Advantageously for positioning the antenna 90 on the integrated circuits20 of the wafer, on the lower surface of the substrate 89 there may bepresent three-dimensional elements 180 that may be assimilated tothree-dimensional fiducials that may be recognized by video cameras ofthe prober as if they were of the probes. These three-dimensionalelements 180 may be for example bumps that may be placed for exampleoutside the antenna 90, as shown in FIG. 35B.

It is understood how in this case the integrated circuits 20 being onthe wafer will be supplied through electromagnetic waves, since they areof the low power type.

Advantageously the antenna 90 may be used for the testing of a pluralityof integrated circuits 20 of the wafer, and possibly and advantageouslythe substrate 89 may comprise also magnetic materials for improving thecoupling between the antennas 30 of the integrated circuits 20 and theantenna 90.

In an alternative embodiment, not shown, it is possible to provide theuse test board arranged between the antenna card 88 and the tester ATE101, this test board having the possibility to contain an integratedtest circuit 87.

According to an aspect, during the assembly, it is possible to realize astacked structure 120 comprising at least two integrated circuits, 20and 20′, as schematically shown in FIG. 36. In particular, theintegrated circuits, 20 and 20′ are overlapped one onto the other so asto place the respective antennas 30 and 30′ in substantial alignmentwith each other, for example according to the development direction ofthe antennas themselves. The integrated circuits 20 and 20′ are suitablyseparated by a layer 121, for example an adhesive insulating material.In an alternative embodiment not shown, the integrated circuits 20 and20′ will be separated by a space or gap.

It is to be understood that in the stacked structure 120 in this way awireless communication channel is created having high performances,whose magnetic flow is indicated with B in the figure. According to anaspect of the invention, each integrated circuit, for example theintegrated circuit 20, comprises a suitable structure 30A realized inthe substrate 24 for improving the wireless communication.

As previously said, around the antenna 30, there may be presentcomposite structures by suitably combining the elements comprised in agroup or sub-group of structures like: at least one insulating trench,at least one magnetic trench, at least one insulating via, at least onemagnetic via, at least one magnetic TSV, at least one insulating TSV.These composite structures may at least in part form the structure 30A.

Alternatively, as schematically shown in FIG. 37 the structure 30A maybe formed by a part of a magnetic trench 70 comprising a lateral coatingportion 67 realized in a magnetic material. The magnetic material 67improves the coupling between the antennas 30 and 30′. In a known way,the lower part of the magnetic trench 70 may be eliminated through theback-grinding of the wafer.

The integrated circuits 20 and 20′ will also have the possibility to beplaced in such a way that their sub-layers are in connection with thelayer 121, as schematically shown in FIG. 38 thus obtaining a back toback configuration. Also face to back, back to back and face to faceconfigurations are however possible. The integrated circuits 20 and 20′may be connected to each other also through traditional TSV.

It is also possible, during the encapsulation step, to insert thestacked structure 120 in a package 150, as schematically shown in FIG.39. In particular, the package 150 comprises at least one encapsulationmaterial 151 of the stacked structure 120 and a package substrate 152,the package 150 being suitable to house at least one integrated circuit20 provided with an antenna 30, as above described. The package 150 isalso provided with external connection elements, for example bumps 153.

In the example shown in the figure, on the package substrate 152 thestacked structure 120 is leaned comprising the integrated circuits 20and 20′, by way of indication, the considerations made being also validin the case in which the package 150 comprises a sole integrated circuit20.

More in particular, the stacked structure 120 comprises incorrespondence with the integrated circuits 20 and 20′ suitable externalconnection elements, for example wirebonds 154 and 154′ and bumps 155and 155′, positioned on the faces of these integrated circuits 20 and20′ opposed to those in connection with the layer 121, in the figureconnected for example to the sub-layers of the integrated circuits 20and 20′.

Suitably, these wirebonds 154 and 154′ and bumps 155 and 155′ areconnected to the package substrate 152, in correspondence with contactpads 156 realized in this package substrate 152.

According to an aspect, the package 150 may possibly also house anantenna 160, in particular a discrete antenna housed on the packagesubstrate 152, preferably of the magnetic dipole type.

This antenna 160 will have the possibility also to supply the powerneeded for the operation of at least one stacked structure 120 or of anintegrated circuit 20 being in the package 150.

According to an alternative embodiment not shown, the package substrate152 is insulated from the integrated circuit 20, that results in thisway galvanically insulated, the same having the possibility to besupplied through electromagnetic waves thanks to the presence therein ofthe antenna 30.

It is also possible, in a further embodiment not shown, to provide toconnect to each other discrete antennas present in at least twopackages.

It is obviously possible to realize the stacked structure 120 thanks tothe structures previously described, or a combination thereof or throughtheir hybrid forms also together with the prior art.

The antenna 160 may be used for the final application or for the testingat the package or FT level, and this antenna may be incorporated in thesubstrate 152 of the package 150, as schematically shown in FIG. 40.Also in this case, the antenna 160 will be discrete, preferably of themagnetic dipole type.

In particular, as schematically shown in FIG. 41, for executing thistesting FT, the package 150 is placed in an interface 170 called socketinside a suitable apparatus called handler, not completely shown, inturn connected to the tester ATE 101 of the testing system 100. Thepackage 150 is connected, at the level of its bumps 153, to suitablecontact terminals 171 of the interface 170.

Furthermore, according to an aspect, an external antenna 172 is providedand connected to the tester ATE 101 for communicating in a wireless waywith at least one integrated circuit 20 present in the package 150.

According to an alternative embodiment, schematically shown in FIG. 42,this external antenna 172 may be incorporated in the interface 170.

It is obviously possible to combine the different embodiments of theintegrated circuits, of the stacked structures and of the packages abovedescribed with other solutions known in the field, obtaining hybridsolutions between the embodiments and the solutions of the prior art.

According to the different embodiments, the antenna 30 being integratedon the integrated circuit 20 is preferably of the inductive type andrealized outside the active area 20A of the integrated circuit 20itself, incorporated at least in part in its peripheral structures, likethe seal ring and/or possibly part of the pad ring.

According to some of the embodiments, the antenna 30 is also able toreplace at least in part the seal ring.

Furthermore, the integrated circuit 20 comprises measures able toincrease the efficiency of the antenna 30 and reduce the interferenceswith its inner circuitry, also allowing the creation of a wirelesscommunication channel that may be used during the manufacturing process,and in particular for a testing of the wireless type, and in the finalapplication.

Finally, the antenna 30 according to the invention, being of thevertical and lateral type, has a reduced space and it is also possibleto size it so as to be able to supply power in a wireless way to theintegrated circuit 20 that comprises them.

Obviously a technician of the field, aiming at meeting incidental andspecific needs, will bring several modifications and alternatives to theabove described structures, all within the scope of protection of theinvention as defined by the following claims.

Having thus described at least one illustrative embodiment of theinvention, various alterations, modifications, and improvements willreadily occur to those skilled in the art. Such alterations,modifications, and improvements are intended to be within the spirit andscope of the invention. Accordingly, the foregoing description is by wayof example only and is not intended as limiting. The invention islimited only as defined in the following claims and the equivalentsthereto.

The invention claimed is:
 1. A probe card for integrated circuit testing, comprising: a printed circuit support; a probe head having a first surface mounted to a surface of the printed circuit support; a flexible substrate positioned adjacent to a second surface of the probe head which is opposite the first surface, said flexible substrate including at least one flexible extension which extends beyond an edge of the probe head and includes a bend to make contact with the surface of the printed circuit support; wherein the flexible substrate further includes a test antenna configured to support a wireless communications channel with an integrated circuit under test.
 2. The probe card of claim 1, wherein the probe head includes a test probe extending from the second surface and configured to support a physical communications channel with the integrated circuit under test.
 3. The probe card of claim 2, wherein the flexible substrate includes an opening and the test probe extends through the opening.
 4. The probe card of claim 2, wherein the test probe has a magnetic feature.
 5. The probe card of claim 4, wherein the magnetic feature is a covering of the test probe by a magnetic material.
 6. The probe card of claim 4, wherein the magnetic feature is that the test probe is made of a magnetic and electrical material.
 7. The probe card of claim 2, wherein the test antenna includes a winding and the wherein the test probe is located within the winding.
 8. The probe card of claim 1, wherein the probe head includes a cavity at the second surface, and further comprising an integrated test circuit located within the cavity.
 9. The probe card of claim 8, wherein the flexible substrate covers the cavity.
 10. The probe card of claim 1, further comprising three-dimensional elements that form optically-recognizable fiducial markings present on a surface of the probe card which faces the integrated circuit under test.
 11. The probe card of claim 1, further comprising automated test equipment (ATE) circuitry that is connected to the printed circuit support.
 12. A probe card for integrated circuit testing, comprising: a printed circuit support having a first surface and a second surface, wherein the second surface faces an integrated circuit under test; wherein the printed circuit support includes a test antenna configured to support a wireless communications channel with the integrated circuit under test; and three-dimensional elements extending from the second surface of the printed circuit support, said three-dimensional elements forming optically-recognizable fiducial markings which face the integrated circuit under test.
 13. The probe card of claim 12, wherein the printed circuit support includes a magnetic material configured to support coupling of the test antenna to the integrated circuit under test.
 14. The probe card of claim 12, wherein the test antenna includes a winding.
 15. The probe card of claim 12, further comprising automated test equipment (ATE) circuitry that is connected to the printed circuit support.
 16. A probe card for integrated circuit testing, comprising: a probe head having a surface configured to face an integrated circuit under test, the probe head including a test probe extending from said surface and configured to support a physical communications channel with the integrated circuit under test; and a flexible substrate positioned adjacent to said surface of the probe head said flexible substrate including at least one flexible extension which extends beyond an edge of the probe head to support making of an electrical connection; wherein the flexible substrate further includes a test antenna configured to support a wireless communications channel with the integrated circuit under test.
 17. The probe card of claim 16, wherein the flexible substrate includes an opening and the test probe extends through the opening.
 18. The probe card of claim 16, wherein the test probe has a magnetic feature.
 19. The probe card of claim 18, wherein the magnetic feature is a covering of the test probe by a magnetic material.
 20. The probe card of claim 18, wherein the magnetic feature is that the test probe is made of a magnetic and electrical material.
 21. The probe card of claim 16, wherein the test antenna includes a winding and wherein the test probe is located within the winding.
 22. The probe card of claim 16, wherein the probe head includes a cavity at the second surface, and further comprising an integrated test circuit located within the cavity.
 23. The probe card of claim 22, wherein the flexible substrate covers the cavity.
 24. The probe card of claim 16, further comprising automated test equipment (ATE) circuitry that is connected to the test probe and test antenna. 